Glass Substrate Packaging Edges Toward Mass Production as Intel and Lens Technology Strike Strategic Alliance
· pandaily.com
Intel and Lens Technology signed a strategic alliance to accelerate glass substrate packaging, as Triassic and Tongge Micro push past the brittleness barrier. TGV yield, multi-layer RDL interconnect, and scale cost control now define the next phase.
Intel and Lens Technology signed a strategic alliance to accelerate glass substrate packaging, as Triassic and Tongge Micro push past the brittleness barrier. TGV yield, multi-layer RDL interconnect, and scale cost control now define the next phase.